| Direct copper bonded ceramic substrates for use with power LEDs |
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IMAPS, Versailles January 2008, Dr. Jürgen Schulz-Harder, Herr Ingo Baumeister und Herr Alexander Roth |
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1.171 KB |
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| High reliability solutions based on direct copper bonded (DCB) substrates |
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Interconex September 2007, Versailles, Dr. Schulz-Harder, Alfred Dehmel |
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335 KB |
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| Wirtschaftsblatt 14.09.2007 |
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Electrovac Spezialist f. hochwertige Werkstoffverbindungen
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644 KB |
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| Hermetic Packaging for Power Multichip Modules |
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EPE Aalborg, 2007; Dr. J. Schulz-Harder, Dipl.-Ing. A. Meyer |
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244 KB |
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| 2007_Galvanotechnik_Qualifizierung am Arbeitsplatz.pdf |
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Mitarbeiterschulung bei der Electrovac |
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2.173 KB |
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| Carbon-Nanofiber Reinforced Cu Composites Prepared by Powder Metallurgy |
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H. Weidmüller, T. Weissgärber, R. Hünert, T. Schmitt, K. Mauthner, Dr. J. Schulz-Harder |
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303 KB |
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| Recent Development of DBC Substrates: Massive Copper Vias and High Temperature Solder Stop |
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Imaps San Diego, Oktober 2006 Dr. Schulz-Harder, Dr. Exel, Dipl.-Ing. Meyer |
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361 KB |
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| Direct Liquid Cooling of Power Electronics Devices |
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CIPS 2006, Napoli; Dr. Jürgen Schulz-Harder, Dr. Karl Exel, Dipl.-Ing. Andreas Meyer |
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198 KB |
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| Efficient Cooling of Power Electronics |
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PCIM 2006 China; Dr. Jürgen Schulz-Harder |
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624 KB |
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| Thermocatalytic Cracking Of Methane |
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WHTC 2005, Singapore; Dr. Hammel, M. Trampert, T. N. Schmidt, X. Tang, K. Mauthner |
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385 KB |
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| DBC - Substrate with Integrated Flat Heat Pipe |
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IMAPS 2005 Belgien; Dr. Schulz-Harder, J. B. Dezord, C. Schaeffer, Y. Avenas, O. Puig, A. Rogg, Dr. Exel |
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146 KB |
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| Advanced DBC Substrates for High Power and High Voltage Electronics |
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EPE 2005 Dresden; Dr. Schulz-Harder, Dr. Exel |
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98 KB |
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| Performance of Carbon Nanofiber Based Thermal Grease |
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IMAPS 2005 Wien; E. Hammel, X. Tang, M. Trampert, K. Mauthner, T. Schmitt, A. Roth, A. Meyer, M.Haberkorn, J.Schulz-Harder |
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986 KB |
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| Study of Carbon Nanofiber Dispersion for Application of Advanced Thermal Interface Materials |
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Nano 2005; X. Tang, E. Hammel, M. Trampert, K. Mauthner, T.Schmitt, J. Schulz-Harder, M. Haberkorn, A. Meyer |
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749 KB |
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| Recent Developments of DBC Substrates for High Resolution Requirements |
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IMAPS 2004 Dänemark; Dr. Schulz-Harder, A. Rogg, Dr. Exel |
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159 KB |
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| Large Area Carbon Nanofibres Cathode For Field Emission Display |
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ASID 2003; X. Tang, E. Hammel, K. Mauthner, M. Trampert, P. Deeben, E. Cosman, B. Kropman, K. Kortekaas, D. den Engelsen |
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219 KB |
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| Innovative Cooling Concept for Highly Integrated Avionics Modules |
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IMAPS 2001 Strasbourg; Dr. Schulz-Harder, Dr. Exel, Dipl.-Ing. Meyer, Dipl.-Ing. Hermann, Dipl.-Ing. Hetterich |
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392 KB |
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| Micro channel water cooled power modules |
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PCIM 2000 Nürnberg; Dr. Schulz-Harder, Dr. Licht, Dr. Exel, Dipl.-Ing. Loddenkötter, Dipl.-Ing. Meyer |
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453 KB |
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| Directionally bent Alumina DBC Substrates |
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IMAPS 1999 Europe, Harrogate UK; Dr. Schulz-Harder, Dipl.-Ing. Franz, Dr. Exel |
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309 KB |
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| New Generation of DBC Substrates for High Efficient Cooling of Power Devices |
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1998; K.L. Credle, Dr. Exel, Dipl.-Ing. Meyer, Dr. Schulz-Harder |
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360 KB |
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