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Home Products DBC Substrates AlN DBC Substrates
AlN DBC Substrates
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Electrovac curamik GmbH
Im Gewerbepark D75
93059 Regensburg
Germany

Phone +49 941 698 090-0
Fax +49 941 698 090-99

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In DBC substrates based on AlN, excellent thermal conductivity is combined with good mechanical stability. The lower coefficient of thermal expansion constitutes a further advantage of AlN over Al2O3. This coefficient being close to that of silicon assures minimal thermal stress between chip and substrate.
DBC substrates based on aluminum nitride ceramics are used mainly in applications involving high operating voltages at high resistance to partial discharge and high reliability requirements, such as in
Railroad traction systems
Applications for the aviation and aerospace industries
Industrial power semiconductor modules at high power densities
More about AlN DBC substrates (PDF 562 KB)
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