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Al2O3 DBC Substrates |
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| The thermal conductivity of Al2O3-DBC substrates is critically dependent upon the thermal conductivity and layer thickness of the ceramic element. Therefore, Al2O3-DBC substrates are offered with different ceramic properties and layer thicknesses (0.25 ... 1.00 mm) for customer-specific applications. |
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As the maximum temperature of the chip directly influences reliability (MTBF – mean time between failures) of a semiconductor component, thermal resistances need to be minimized to keep this temperature as low as possible.
Curamik Electronics manufactures DBC in large sheets of sizes 5"x7" or 5.5"x7.5". Compared to the production of individual parts as practiced 15 years ago, the availability of large sheets facilitates assembly processes and in-process controls on the part of the user.
As the key element of a power module, the DBC substrate is essential regarding reliability of the complete system during temperature cycling. To meet individual systems requirements, we offer a range of different design elements.
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