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Features of DBC |
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Products
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Contact |
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Electrovac curamik GmbH
Im Gewerbepark D75
93059 Regensburg
Germany
Phone +49 941 698 090-0
Fax +49 941 698 090-99
Send e-mail |
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Features of DBC |
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| All design elements described apply to both Al2O3 and AlN-DBC substrates. |
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| Integrated connections |
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Reliable connections among different module supports |
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Space saving through no additional welding or bonding pads |
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Increased convenience through facilitated assembly |
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SMD-capable in bent SIL or DIL modules |
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High current carrying capacity up to 100 amperes/mm |
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| Dimple design |
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Reduction of thermally induced stress |
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Increase of DBC temperature cycling reliability by 10 times |
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No additional costs |
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| Fineline |
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High pitch |
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Lower assembly costs |
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Power and logic combined on one substrate |
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Smaller module size |
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Fewer suppliers needed |
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Interconnections/ Vias
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High-power contact between front and back panel |
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Current up to 100 A |
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Low specific resistance (100 µOhm) |
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Also applicable for protecting purposes |
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| Solder resist |
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Efficient barrier against soldering flux |
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Optimal alignment of chips |
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