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Partner Center Login:  Pass:  Home Media & Services Publications Publications Media & Services Publications Dates/Events Archive Here you find selected publicatons of Electrovac employees for download. All rights to distribute the publications or extracts thereof are reserved. Direct Copper Bonded Substrates for Semiconductor Power Devices PEMC; Dr. Jürgen Schulz-Harder 523 KB pdf Hermetic Packaging for Power Multichip Modules EPE Aalborg, 2007; Dr. J. Schulz-Harder, Dipl.-Ing. A. Meyer 244 KB pdf © Electrovac Print